JPH0131698B2 - - Google Patents

Info

Publication number
JPH0131698B2
JPH0131698B2 JP58016078A JP1607883A JPH0131698B2 JP H0131698 B2 JPH0131698 B2 JP H0131698B2 JP 58016078 A JP58016078 A JP 58016078A JP 1607883 A JP1607883 A JP 1607883A JP H0131698 B2 JPH0131698 B2 JP H0131698B2
Authority
JP
Japan
Prior art keywords
thin plate
silicon carbide
ceramic
bonding
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58016078A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59143344A (ja
Inventor
Akira Enomoto
Hidetoshi Yamauchi
Shoji Tanigawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP58016078A priority Critical patent/JPS59143344A/ja
Publication of JPS59143344A publication Critical patent/JPS59143344A/ja
Publication of JPH0131698B2 publication Critical patent/JPH0131698B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
JP58016078A 1983-02-04 1983-02-04 電子回路用炭化珪素質基板の製造方法 Granted JPS59143344A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58016078A JPS59143344A (ja) 1983-02-04 1983-02-04 電子回路用炭化珪素質基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58016078A JPS59143344A (ja) 1983-02-04 1983-02-04 電子回路用炭化珪素質基板の製造方法

Publications (2)

Publication Number Publication Date
JPS59143344A JPS59143344A (ja) 1984-08-16
JPH0131698B2 true JPH0131698B2 (en]) 1989-06-27

Family

ID=11906517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58016078A Granted JPS59143344A (ja) 1983-02-04 1983-02-04 電子回路用炭化珪素質基板の製造方法

Country Status (1)

Country Link
JP (1) JPS59143344A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06105722B2 (ja) * 1985-10-14 1994-12-21 株式会社日立製作所 セラミック接合方法及びセラミックパッケージの製法及びセラミックパッケージ
JP5207052B2 (ja) * 2008-08-22 2013-06-12 株式会社豊田中央研究所 接合体およびその製造方法
KR102484357B1 (ko) * 2021-02-26 2023-01-04 해성디에스 주식회사 롤투롤 패널 레벨 패키지

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925743B2 (ja) * 1976-04-16 1984-06-20 大日本塗料株式会社 セラミツクスおよびガラスの封着方法
JPS57117261A (en) * 1981-01-14 1982-07-21 Kyocera Corp Package for semicondutor device

Also Published As

Publication number Publication date
JPS59143344A (ja) 1984-08-16

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